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Application of Piezo Nanomotion Products in Semiconductor Film Deposition!

Update time：2023-11-30 10:21:53Clicks：1089second

With the continuous development of the semiconductor industry, the semiconductor chip manufacturing industry moves forward constantly, and the level of its process directly determines the quality and efficiency of chip production. Thin film deposition is one of the core processes in the chip manufacturing process, which is the key to determine the performance of thin films. Its role is to repeatedly stack metal films (such as aluminum, copper, tungsten, titanium, etc.) and oxides (such as silicon dioxide, silicon nitride) on the wafer surface by physical or chemical methods. The thickness of the film ranges from nanometer to micron level, and the photolithography, etching and other processeson can be done on these films, and finally form each layer of circuit structure.

Thin film deposition equipment can be divided into PVD, CVD and ALD equipment according to different process principles, respectively corresponding to three process principles of physical vapor deposition (PVD), chemical vapor deposition (CVD) and atomic layer deposition (ALD).

Note: The image is from the Internet

As the size of wafer used in the chip manufacturing process continues to increase, while the minimum feature size decreases, which greatly increases the requirements for the refinement of film performance parameters. The uniformity, step coverage, and groove filling become important indicators to measure the quality of film deposition, which requires the film deposition equipment to integrate ultra-precision moving parts to achieve film deposition on the wafer surface to help improve the manufacturing process and increase the yield of good products.

Note: The image is from the Internet

Application of CoreMorrow Piezo Nanomotion Products in Film Deposition Eequipment

1.Control the thickness and evenness of the film：CoreMorrow piezo actuator can control the deposition rate and evenness of the film by generating tiny vibrations, so as to achieve high-quality film deposition.

2.Improve the deposition rate：CoreMorrow piezo actuator can increase the deposition rate by generating high-frequency vibration, thereby shortening the deposition time and improving production efficiency.

3.Improve film quality：CoreMorrow piezo actuators can improve the quality of the film by controlling the microstructure and crystal structure of the film surface, so as to improve the performance of semiconductor devices.

4.Achieve nanoscale processing：CoreMorrow piezo actuators can achieve nanoscale processing by generating nanoscale vibration, such as preparing nanowires, nanoholes and other nanostructures.

5.Adjust the position of the wafer, heating disc and spray plate, to make them concentric：CoreMorrow piezo nanopositioning stage can carry out X, Y, Z single-axis or three-axis motion, and resolution up to millimeter. With a high-precision sensor, the stage can achieve nanoscale resolution and positioning accuracy has high reliability. The position of wafers, heating plates and spray plates can be adjusted horizontally or vertically to keep them on the same axis.

6.The multi-angle motion of the heating disc makes the film deposition more even：CoreMorrow piezo tip/tilt stage can be accurately adjusted by piezo ceramic drive. With very high deflection accuracy and stability, and fast response speed, it can make the heating disc carry out multi-angle or rotating motion during the film deposition process, so that the heating disc can be done in any Angle position with the spray plate, and makes the film deposition more even.

CoreMorrow Typical Models

The key component of the film deposition equipment is the vacuum system, wafer film deposition needs to be carried out in vacuum environment, CoreMorrow piezo nanomotion products can be customized according to the user's environment, including the vacuum version and other parameters such as axis of motion, stroke, load capacity, operating frequency, and aperture, etc.