I. Low-Voltage Piezo Plate/Ring Actuator/Stack

Sheet-like piezoelectric ceramics are made of PZT5A material with the standard thickness of 2mm. It has a square or ring-shaped structure. A single piece can generate a displacement of 3.3μm, which makes it an ideal choice for precision control systems.

The internal structure of this low-voltage piezo plate is shown in the following figure. Its interior is composed of ceramic layers and electrode layers stacked in a cross pattern. The left and right sides are the positive and negative electrode surfaces, and the top and bottom are insulating ceramic materials.

To achieve a greater displacement, we stack multiple piezo plates and weld a common electrode. Through this structure, the total displacement is the accumulation of the displacements of each piece. In standard products, the displacement after stacking can reach 128.7μm, and higher specifications can be customized.

In addition, for ultra-high vacuum environments, we offer custom UHV versions with a pressure resistance capacity of up to 10^-10Torr (1.33×10^-10mbar), which can meet the requirements of scientific research and semiconductor environments.

Our technological strength lies in the flexible customization capability. The core advantage of piezo stacks stems from the mature and controllable precision stacking process of individual pieces, and the high degree of freedom in selection. In addition, there is a 1mm thick non-polarized ceramic insulating sheet at the top and bottom of the piezo stack. When the mobile end comes into contact with the conductive material, it can effectively prevent the risk of short circuit at both ends.

Electrodes in same side: Facilitates wiring in confined Spaces.

With aperture: For optical light transmission or mechanical fixation.

High flatness: 5μm parellelism.

II. Precautions for High-Frequency Work

The product is adaptable to application scenarios such as high-frequency reciprocating drive and high-speed dynamic regulation. Regarding the risks in high-frequency use, the following four key points should be noted to ensure the long-term reliable operation of the device:

1.High-frequency operation will cause the ceramic to heat up by itself. When the temperature exceeds 150℃, the electrode may fall off.

2. High-acceleration operation will exert mechanical force on the leads. It is recommended to use appropriate electrical connection methods such as conductive adhesives to buffer stress.

3. High-frequency use will exert tensile force on the piezo stack, and a preload force needs to be added to the piezo stack. The preload depends on the application, but it is usually 5 to 10MPa of pressure.

4. High-frequency use requires a large current. It is necessary to ensure that the leads can operate within the required current range. The standard lead can withstand a maximum current of 1.4A.

III. Working Temperature Environment

Piezo stack actuators have an extremely wide operating temperature range and are suitable for various scenarios from deep space exploration to high-temperature industries. Normal range: 4mK to 470K (approximately 200℃). It should be noted that:

High temperature risk: When the ambient temperature exceeds 150℃, although the ceramic itself has an extremely high temperature resistance, there is a risk of electrode detachment, and special attention should be paid to heat dissipation.

Low temperature performance: In an extremely low temperature environment close to absolute zero (4K), the performance of piezo ceramics will decline, approximately 10% of that at room temperature. If dynamic operation is required at low temperatures, dedicated low-temperature leads must be replaced to ensure the reliability of electrical connections.

Displacement vs. Temperature Curve

IV. High-Frequency Power and Current Calculation

The piezo stack only requires power/current during dynamic operation. The output current of the amplifier and the rise time determine the upper limit of the operating frequency of the piezo stack.

V. Technical Data of Products