The capacitive micrometer is a high-precision measuring instrument based on the principle of capacitive sensing. It is mainly used for non-contact detection of physical quantities such as minute displacement, thickness, gap, and vibration. It is widely applied in fields with high requirements for measurement accuracy, such as precision manufacturing, semiconductors, optical technology, and aerospace. It is a key supporting measurement component for piezo nano-positioning and micro-nano processing equipment. CoreMorrow new capacitive micrometer C2D18 features a 2mm large travel measurement capability. While achieving a breakthrough in measurement range, it consistently adheres to nano-level measurement accuracy, perfectly balancing the core demands of wide measurement range and high precision.

I. New Product Recommendation: 2mm Range Capacitive Micrometer C2D18

The capacitive micrometer achieves precise measurement of minute quantities by converting the changes in the measured physical quantities, such as tiny displacements, into changes in capacitive values, and then converting the capacitive changes into readable electrical signals through signal processing circuits. Its measurement resolution can reach the nanometer level and it is one of the core tools in micro-nano scale measurement.

Based on the existing product line of capacitive micrometers, we have added the 2mm range capacitive micrometer C2D18, further improving the full range coverage from 100μm to 2mm. This product is designed to offer a broader range of nanometer-level perception capabilities for multiple scenarios such as high-end precision processing, piezo positioning system matching, industrial inspection, and scientific research experiments. It provides a more comprehensive solution for large-stroke and micro-quantity measurement, while also enhancing the flexibility and adaptability of the overall measurement solutions.

II. Application Fields of Capacitive Micrometers

Capacitive micrometers, with their unique advantages such as nanometer-level precision, non-contact measurement, rapid response and high stability, have become core tools in the modern precision measurement field and are widely used in multiple industries with extremely high precision requirements.

Full-Process Monitoring of Wafer Processing: Measurement of wafer thickness and warpage, surface defect analysis, mask positioning, and multi-axis displacement feedback of the wafer platform.

Chip Packaging and Testing: Alignment between packaging layers, control of chip bonding pressure and gap,etc.

Optical Component Manufacturing: Measurement of lens curvature, parallelism, and center thickness, control of optical component coating thickness, calibration of optical prism angles, detection of OLED panel thickness uniformity, measurement of glass substrate warpage, etc.

Ultra-Precision Machining and Monitoring: Detection of rotational accuracy of machine tool spindles, measurement of straightness of precision guide rails, monitoring of wear degree of molds, detection of displacement, deformation and vibration of micro-nano structures, etc.

(Note: Image sourced from the internet)

Aircraft Manufacturing: Precise measurement of fuselage dimensions, detection of interlayer gaps in composite materials, vibration analysis of core components such as aero-engine blades, and monitoring of the deployment status of spacecraft solar panels, etc.

Automotive Manufacturing Quality Control: Detection of thickness changes in brake discs, measurement of flatness of engine blocks;

New Energy Equipment Manufacturing: Thickness measurement of lithium battery electrode sheets, thickness detection of fuel cell membrane electrode assemblies, deformation monitoring of wind turbine blades, etc.

Equipment Integration: It can be used as a sample stage position monitoring sensor for scanning probe microscopes, confocal microscopes and other equipment, expanding the longitudinal measurement range of the equipment;

Material and Environmental Testing: Elastic modulus testing of composite materials, fatigue testing, micro-deformation monitoring, displacement detection and non-interference precise positioning in special environments such as vacuum, low temperature and strong magnetic field, etc.

(Note: Image sourced from the internet)

The capacitive displacement measurement system of CoreMorrow is suitable for high-precision positioning, angle/linear vibration measurement, thickness detection (film thickness measurement, wafer thickness measurement, brake disc thickness measurement, oil film thickness measurement, etc.), rotating machinery clearance measurement, jumping measurement (shaft jumping measurement, etc.), automatic focusing or zeroing, dielectric constant measurement, astronomical telescope lens positioning, outer diameter measurement, deformation measurement, etc.

III. Core Features of CoreMorrow Capacitive Micrometers

With nanometer measurement resolution and high measurement accuracy, it can meet the strict requirements of micro-nano scale measurement.

During the measurement process, the sensor has no mechanical contact with the object being measured, which will not cause scratches or wear on the measured surface, nor will it lead to measurement errors due to contact force. It is suitable for measuring fragile workpieces, flexible materials or high-speed moving objects.

The detection of capacitive changes is not affected by mechanical inertia. The response time of the signal processing circuit can be down to the microsecond level, capable of capturing dynamic changes in real time such as minute vibrations and high-speed displacements, and can be used in dynamic measurement and closed-loop control scenarios.

It can effectively counteract environmental interferences such as temperature drift and power supply fluctuations. A stable structure and no vulnerable parts brings the capacitive sensors  high long-term stability and low maintenance costs.

The CxxDxx series capacitive micrometers have a measurement range covering 100μm to 2mm, achieving large-scale measurement from the micrometer level to the millimeter level. They can not only meet the requirements of micro-displacement measurement in micro-nano processing but also be adapted to the gap detection of precision machinery.

When the object under test has a certain degree of electrical conductivity and meets the conditions, measurement can be carried out without being affected by the material. It is suitable for precise detection of various materials such as metals, semiconductors, glass, and ceramics.

IV. Full Range of CoreMorrow Capacitive Micrometer Products

2) Sensor Controller (Signal Processing)

E75 Series Single-Channel, Small-Sized Sensor Controller

E75 single-channel sensor controller adopts a single-channel design, featuring a compact and streamlined structure. Its small size enables it to flexibly adapt to various scenarios with limited space. It is compatible with various models of capacitance micrometers which can be widely used in scenarios such as single-point micro-displacement measurement and closed-loop control of small piezo positioning systems, providing efficient and accurate solutions for single-channel high-precision sensing requirements.

E01 Modular, Multi-Channel Sensor Controller

The E01 chassis-type sensor controller is compatible with multiple models of capacitive micrometers, featuring nanometer-level measurement resolution. It adopts a modular design concept and supports 1 to 12 channels available. It can be flexibly combined according to actual needs and is suitable for various scenarios. It offers two forms: desktop structure and board card plug-in, taking into account both the convenience of independent use and the compatibility of system integration.